BURN-IN Test Socket
The Burn-In Test Socketis a device used to test electronic components, such as semiconductors, under extreme temperature and load conditions over an extended period. The goal is to detect potential failures and ensure the reliability of the components before their integration into final products. These sockets provide reliable contact with the component during the testing process, simulating continuous operation and testing the durability of the tested hardware.
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Accelerated Lifetime Test Solution
C-Series H-Pin® Test Socket
The C-Series H-Pin® socket is a modular burn-in socket with a clamshell-type cover. Its compact design allows for an unmatched range of package compatibility, from package sizes of 0.50 mm to 12.00 mm, while providing optimal socket density per burn-in card.
Accelerated Lifetime Test Solution
D Series H-Pin® Test Socket
The D-Series H-Pin® socket is a high-performance burn-in socket, with a clamshell-type cover that can be equipped with heating and thermal sensing. The D-Series line shares the same configurable features as the other test socket series in Smiths Interconnect's "burn-in" range. By leveraging H-Pin technology, the D-Series line offers leading electrical performance for high-speed burn-in applications.
ES Series H-Pin® Test Socket
The ES Series family of sockets is designed to be used with all advanced burn-in systems. With this adaptation, we offer unmatched value by providing cutting-edge technology. The C-Series H-Pin® socket is a modular burn-in socket with a clamshell-type cover. Its compact size allows for an unparalleled range of package compatibility, from a package size of 0.5 mm up to 12 mm, while providing optimal socket density per burn-in card.
Micro ES Series H-Pin® Test Socket
The ES Micro Series socket represents a technological advancement in the burn-in socket segment, featuring a double-locking clamshell cover that ensures coplanar pressure on the DUT when the cover is engaged. The inclusion of patented H-Pin contact technology in the ES Micro-Series socket offers leading electrical performance in the smallest possible footprint, ensuring maximum parallelism on a burn-in card. This series is compatible with standard heaters and temperature sensors.
K Series H-Pin® Test Socket
The K-Series socket is designed to apply uniform and flat pressure on the DUT through a secondary lever once the cover is closed. This ensures that the plate does not slide over the top of the device when closing the cover, which could mark the device. This is particularly important for exposed die products or automotive applications where appearance is part of the acceptance criteria after testing. The vertical lever actuation does not increase the overall footprint of the socket, thus allowing for the highest density of populated sites on the burn-in board and, in some cases, reduces the overall footprint compared to other clamshell cover sockets. Another advantage of the K-Series cover is the airflow through the socket due to its higher profile, allowing for larger air channels to help maintain precise temperatures.
M-Series H-Pin® Test Socket
The M-Series socket has long been the gold standard in burn-in sockets for reliability and performance right out of the package. High-quality components have been refined and improved over time to deliver optimal performance and exceptional quality. The fact that the M-Series is one of the most mature products in the portfolio does not mean it lacks technology. On the contrary, the M-Series offers all configurable features and high-performance H-Pin contact technology to exceed the expectations of the most demanding applications. The M-Series is recognized for its uncompromising performance, generation after generation. Its small footprint allows for design flexibility and high density of sockets on the burn-in board.
Q-Series H-Pin® Test Socket
The Q-Series socket is available for medium to large package sizes. It features a fully molded socket body and cover, designed to meet the requirements of a wide range of accelerated lifetime testing applications. The cover can be configured with or without a heat sink for accurate thermal response, and through design simulation, the air channels are optimized to maintain a precise temperature throughout the tests.
QN-Series Test Socket
Smiths Interconnect has taken a leading role in the design and development of socket solutions for new QFN packages such as MLF, BCC, and LPCC. These sockets offer a modular design in a small format with very low inductance. The new QFN Open Top socket allows for more convenient loading and unloading of packages while providing most of the same pin count options as the version with a cover.
R-Series H-Pin® Test Socket
The R-Series is an open-top socket used for accelerated reliability testing. With versions of the open-top design available as a direct replacement for other legacy products on the market, there is no need to purchase new burn-in boards. The open-top design allows for automatic loading and unloading of integrated circuits. The small footprint of the socket allows for full utilization of the available resources in the burn-in system for each burn-in board.
H-Pin® - Stamped Contact
The H-Pin is a stamped spring probe that offers the mechanical, electrical, and thermal performance of a spring probe, with the ease of use and high-volume manufacturability of a stamped contact. The H-Pin serves applications without the usual compromises that are typically necessary when trying to balance cost and performance.
